PROCESS FOR FABRICATION OF 3-DIMENSIONAL MICROMECHANISMS
摘要
This invention provides a fabrication process for manufacturing of truly 3-dimensional micromechanisms which takes advantages of SOI (silicon-on-insulator) wafers each of which is processed to create a respective structural element of the 3-dimensional micromechanisms by DRIE (deep reactive ion etching) of the wafer and thermal oxidation of the trenches opened during the DRIE etching. The wafers are sequentially bonded into a multistack structure from which the 3-D micromechanism is released by XeF2 etching. Thermally grown SiO2 is used as structural material for the 3-D micromechanism.
申请公布号
WO0118857(A1)
申请公布日期
2001.03.15
申请号
WO2000US20811
申请日期
2000.09.01
申请人
UNIVERSITY OF MARYLAND, COLLEGE PARK;DEVOE, DONALD, LAD;TSAI, LUNG-WEN