PROCESS TO IMPROVE FILLING OF CONTACT HOLES BY ELECTROPLATING

摘要

PURPOSE: An electroplating process of a substrate is provided to form a seed layer and a barrier layer prior to filling the structure on the substrate. CONSTITUTION: In a method for filling a structure on a substrate, a barrier layer is deposited on one or more surfaces of the structure and a seed layer is deposited over the barrier layer. Then, a portion of the seed layer is removed and a metal is electrochemically deposited to fill the structure. Preferably, a portion of all of the seed layer formed on the sidewall portion of the structure is removed using an electrochemical de-plating process prior to the electroplating process.