CLEANING APPARATUS OF POLISHING HEAD FOR POLISHING SEMICONDUCTOR

摘要

PURPOSE: A cleaning apparatus of a polishing head for polishing a semiconductor is provided to improve yield and reliability of a semiconductor device, by reinforcing a cleaning function of a polishing head by further supplying deionized(DI) water at high pressure. CONSTITUTION: A polishing pad(22) is adhered to an upper surface of a revolving plate(20). A polishing head(30) polishes a wafer, moving while holding the wafer over the polishing pad. A retainer ring(32) is coupled to a circumference of the polishing head, and a plurality of polishing liquid inducing holes(32a) are penetrated in the retainer ring. A polishing liquid supplying pipe(72) emits polishing liquid(72a) toward the polishing liquid inducting hole of the retainer ring and the polishing pad. The polishing liquid supplying pipe is buried in an emission arm. A high pressure spraying pipe sprays deionized(DI) water(74a) of high pressure toward the polishing liquid inducing hole of the retainer ring to clean the polishing liquid induced into the polishing head.