METHOD FOR PROCESSING WAFER OF SINGLE-WAFER-TYPE SEMICONDUCTOR MANUFACTURING EQUIPMENT

摘要

PURPOSE: A method for processing a wafer of a single-wafer-type semiconductor manufacturing equipment is provided to guarantee repeatability of a capacitor, by preventing an unnecessary hemispherical grain from growing while a wafer is in a stand-by state in a chamber for forming the hemispherical grain. CONSTITUTION: A predetermined treatment is peformed while a wafer is placed on a susceptor in a temporary process chamber. A wafer supporting unit is elevated to prevent the predetermined treatment from proceeding so that the wafer is separated from the susceptor. The wafer is checked whether the wafer can be transferred to another process chamber. If the wafer cannot be transferred, the wafer supporting unit continuously stands by while the wafer supporting unit is elevated, until the wafer can be transferred to another process chamber. If the wafer can be transferred, the wafer is transferred to another process chamber.