STRUCTURE FOR INTERCEPTING MOLD FLASH IN SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A structure for intercepting a mold flash in a semiconductor package is provided to prevent a defective plating caused by a mold flash generated in a molding process, by forming an intercepting groove to prevent a resin material from flowing out in the molding process. CONSTITUTION: Out leads(11c) are installed in an outside portion of a molding part(16). An intercepting part is installed in a predetermined portion of the out leads to prevent molding resin from flowing out in a molding process. The intercepting part can be an intercepting groove(20) which has uniform width and depth.