SUBSTRATE OF CIRCUIT BOARD

摘要

A metal-clad laminate is provided for a printed-circuit board capable of dissipating heat and superior in thermal conduction. A substrate overlaid with a lead frame is also provided for a printed-circuit board. A carbon-base substrate (1) is overlaid with metal foil (3) or lead frames with insulating adhesive (2) to form a substrate for a circuit board. With metal foil (3) the substrate forms a metal-clad laminate for a circuit board, while with lead frames the substrate forms a laminate overlaid with lead frames.