METHOD OF MOUNTING ELECTRONIC DEVICE ELEMENT AND MANUFACTURE OF SURFACE ACOUSTIC WAVE DEVICE

摘要

PURPOSE: Disclosed is a method of mounting an electronic device element for forming an electronic component of small size and can bond an electronic device element to a packaging box having high reliability and has satisfactory electronic characteristics. CONSTITUTION: This method is for mounting an electronic device element in a packaging box(35) by applying ultrasonic waves to the element, while putting the pressing surface of a bonding tool(37) onto the bottom of the electronic device element having a metal bump(34) on its obverse surface. Here, the maximum length of the pressing surface of the bonding tool in the direction of vibration of the ultrasonic waves is larger than 0.5 times the maximum length of the bottom of the electronic device element in the direction of vibration of the ultrasonic waves. The pressing surface of the bonding tool has a hole(38) for vacuum-chucking the electronic device element, the hole(38) being positioned at the bottom of a portion where the metal bump of the element is not formed, when the electronic device element is vacuum-chucked.