| 摘要 |
PURPOSE: A probe for probe card is provided to conductivity prevent from lowering by preventing oxidation on the surface at the forward end part of the probe and preventing adhesion of aluminum oxide. CONSTITUTION: An Ni plating layer (3) containing Teflon is formed at the forward end part of a probe (1) through an underlying Ni plating layer (2). Thickness of the Ni plating layer is preferably set in the range of 0.5-2 μm in order to ensure adhesion of Ni plating containing Teflon having thickness preferably set in the range of 0.5-2 μm in order to ensure slipperiness. Since the probe (1) has forward end part coated with the Ni plating layer (3) containing Teflon, wear resistance is not damaged and high conductivity is provided. Furthermore, the end face touching an integrated circuit is protected against oxidation and adhesion of aluminum oxide is prevented substantially completely because slipperiness is enhanced by Teflon and thereby conductivity can be sustained stably.
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