WAFER HOLDER

摘要

A wafer (22) is placed on the surface of a holder (23), which is held horizontally in a plurality of grooves (14) formed in a heat treatment furnace. The holder has the shape of a disc with no cuts and includes ringlike projections (24) extending from its center and projecting upward. The wafer is held in contact with the upper ends of the projections of the holder. The maximum distance between the diametrically opposed projections ranges from 0.5D to 0.98D so that the projections may not come in contact with the periphery of the wafer, where D is wafer diameter. The holder is manufactured without warpage to prevent slip defects from appearing in a wafer. The holder supports any of wafers of different sizes exactly in place. The holder facilitates loading and unloading a wafer.