发明名称 |
IMPROVED APPARATUS AND METHODS FOR INTEGRATED CIRCUIT PLANARIZATION |
摘要 |
An apparatus for planarizing or patterning a dielectric film on a substrate is provided. The apparatus includes a press for applying contact pressure to an operably connected compression tool. The compression tool has a working face that is planar or patterned. A controller for regulating the position, timin g and force applied by the compression tool to the dielectric film is also provided. There is also provided a support, with an optional workpiece holde r for supporting the substrate and dielectric film during contact with the compression tool. Methods of using the apparatus, as well as planarized and/ or patterned dielectric films are also provided.
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申请公布号 |
CA2384463(A1) |
申请公布日期 |
2001.03.15 |
申请号 |
CA20002384463 |
申请日期 |
2000.09.11 |
申请人 |
ALLIEDSIGNAL INC. |
发明人 |
DRAGE, JAMES S.;LEVERT, JOSEPH A.;TOWERY, DANIEL LYNNE;ENDISH, DENIS H. |
分类号 |
H01L21/3205;G03F7/00;H01L21/3105;H01L21/316;H01L21/768;H01L23/522;(IPC1-7):H01L21/310;B44B5/02 |
主分类号 |
H01L21/3205 |
代理机构 |
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