POLISHING PAD FOR CHEMICAL AND MECHANICAL POLISHING

摘要

PURPOSE: A polishing pad for carrying out chemical and mechanical polishing is provided to resolve the ununiformity of slurry supply due to the radial movement of the slurry toward an edge part by the rotation of a platen when a chemical and mechanical polishing device is operating, thereby abrasing the surface of a wafer uniformly. CONSTITUTION: A polishing pad(220) for carrying out chemical and mechanical polishing is provided on a lower platen of a chemical and mechanical polishing device and formed with a plurality of coaxial circular grooves(225) on a top surface to be discretely arranged more closer toward a center part. The polishing pad is defined into three parts of a center part, an intermediate part, and an outer peripheral part according to the interval between the grooves, wherein first grooves(225a) formed in the center part are formed with an interval closer than second grooves(225b) formed in the intermediate part and the second grooves are formed with an interval closer than third grooves(225c) formed in the outer peripheral part, so that the intervals of the grooves are proportional to a radius of the polishing part.