MOLDING APPARATUS FOR SEMICONDUCTOR CHIP

摘要

PURPOSE: A molding apparatus used for a semiconductor chip is provided to minimize a thermal transformation of a substrate during an encapsulation of the chip with mold resin. CONSTITUTION: A molding apparatus(100) includes upper and lower mold dies(10,20). The upper mold die(10) has a cavity(5) and a mold resin injection hole(6). A semiconductor semi-assembly(70) in which a semiconductor chip(40) is attached on a substrate(50) by an adhesive(30) and wire-bonded by wires(60) is horizontally placed between the mold dies(10,20). The chip(40) and the wires(60) are accommodated in the cavity(5) and encapsulated with the mold resin injected through the injection hole(6). In particular, the lower mold die(20) has a vacuum hole(22) to fix the substrate(50). The vacuum hole(22) communicates with a recess portion formed on a top of the lower mold die(20), and a porous plate(24) is inserted in the recess portion. The substrate(50) is entirely attached to the porous plate(24) and fixed thereto, so that a thermal transformation such as warpage of the substrate(50) is not minimized.