| 摘要 |
PURPOSE: A semiconductor package including a lead frame of which a chip pad is used as a path for heat radiation is provided to effectively prevent moisture from penetrating into the semiconductor package, by a thin and long groove on the first surface of the chip pad, a wind part of a slit and a swagging processing unit in an edge of the chip pad. CONSTITUTION: A lead frame has a chip pad(100) in which a part of the first surface having a chip(106) and the second surface opposite to the first surface is exposed to the outside of a semiconductor package. The chip is mounted on the chip pad and attached by the chip pad and epoxy. A gold wire connects a bond pad formed in the chip with inner leads of the lead frame corresponding to the bond pad. Encapsulating molding compound(EMC)(104) exposes a part of the second surface of the chip pad, surrounding the first surface of the lead frame chip pad, an upper portion of the chip pad and all of the inner leads. Outer leads are exposed to the outside of the EMC, correspondingly connected to the inner leads of the lead frame. At least two swagging processing units(116) are formed in an edge of the chip pad of the lead frame. A thin and long groove(112) is formed on the second surface of the chip pad of the lead frame in an edge of an exposed region not covered with the EMC. A thin and long groove(108) is formed on the first surface of the chip pad of the lead frame. At least one slot(110) is formed on the chip pad of the lead frame. |
