发明名称 METHOD AND DEVICE FOR ARRANGING SUBSTRATE
摘要 PURPOSE: A method is provided to realize a method for arranging substrates by which the width of arrangement of the total substrates can be reduced by nanowing the intervals between the substrate. CONSTITUTION: A method for arranging wafers W comprises a step of separating wafers W, arranged and housed in a carrier C at equal intervals L, into a first substrate group in which wafers W are arranged with the equal intervals L and a second wafer group, in which the wafers W are arranged with equal intervals L, a step of turning the second substrate group around by 180°C, and a step of inserting each wafer W of the first substrate group between wafers of the second substrate group, to form a third substrate group in which wafers are arranged at equal intervals L/2, with approximately half the equal intervals L.
申请公布号 KR20010021424(A) 申请公布日期 2001.03.15
申请号 KR20000049625 申请日期 2000.08.25
申请人 TOKYO ELECTRON LIMITED 发明人 TAKAGUCHI REI
分类号 H01L21/68;B65G49/07;H01L21/00;H01L21/677;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址