METHOD FOR PRODUCING SILICA SLURRY FOR WAFER POLISHING

摘要

PURPOSE: A method for producing silica slurry for a wafer polishing is provided by silica grains having a relatively higher weight percent and made economically. CONSTITUTION: A method producing silica slurry includes a step of growing spherical silica grains having uniform size distribution. Here, thermally decomposed silica grains or colloid silica grains are used as growing seeds, and hydrolysis and condensation polymerization reactions of tetraethylorthosilicate(TEOS) are made under a base atmosphere. The grown silica grains are then dispersed into a water solution substituted for alcoholic solvent as dispersion media by using a vacuum evaporator and a centrifugal separator. In addition, the silica grains are treated with heat in an autoclave for one or two hours. This method can provide silica grains of required size by controlling amount of reactant and using various-sized growing seeds.