发明名称 Hochfrequenzschaltungsbauelement
摘要 <p>The circuit has a number of separate hf circuit elements (1a,b), each with two bonding islands (4,11). The second bonding islands (11) are coupled to the earth potential and are located on opposite sides of the first bonding island (4). A first wire (2), transmitting a HF signal, couples the first bonding island of two adjacent HF circuit elements. Two second wires (12) couple the second bonding islands of the adjacent HF circuit elements and are located parallel to the first wire.</p>
申请公布号 DE19641875(C2) 申请公布日期 2001.03.15
申请号 DE1996141875 申请日期 1996.10.10
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 NOTANI, YOSHIHIRO;KATOH, TAKAYUKI
分类号 H01L25/18;H01L23/538;H01L23/66;H01L25/04;(IPC1-7):H01L23/64;H05K1/18;H05K7/00 主分类号 H01L25/18
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