| 摘要 |
PURPOSE: Provided is a chemical/mechanical polishing device where the dispersion of the polishing rate is little. CONSTITUTION: A chemical/mechanical polishing device(20) has a polishing face, a carrier head(34), which pushes a board(10) against the polishing face with controlled pressure, motors(26,36), which generate relative motion at some speed between the polishing face and the carrier head, and controllers(42,44). These controllers are so constituted as to keep a constant torque, friction, or frictional coefficient, changing at least one of the pressure or the speed, in response to the signal depending upon the friction between the board and the polishing face. |
