SEMICONDUCTOR CHIP PACKAGE HAVING DUAL LEADS

摘要

PURPOSE: A semiconductor chip package having dual leads is provided to minimize ground noise and to remarkably reduce a distorting phenomenon of a signal while being used in a signal transmission of a high speed digital pulse higher than several hundred megahertz, by greatly reducing inductance. CONSTITUTION: A plurality of bonding pads(12) is formed in a semiconductor chip(11). The semiconductor chip is adhered to a die pad(13). The first lead(15) is located in an upper portion, composed of a group of leads separated from the die pad by a predetermined interval. The second lead(16) contacts the first lead, located in a position under the first lead. A bonding wire(17) is adhered to the leads and the semiconductor chip for an electrical interconnection. A package body(18) encapsulates a part of the semiconductor chip, the bonding wire and the leads.