APPARATUS AND METHOD FOR DETECTING END POINT IN CHEMICAL MECHANICAL POLISHING PROCESS

摘要

PURPOSE: A method is provided to precisely detect an end point in a chemical mechanical polishing(CMP) process, by an electrical chemical method which is proved to be a precise analysis. CONSTITUTION: Slurry solution used as a polishing agent in a chemical mechanical polishing(CMP) process is provided. A constant potential difference is applied to the slurry solution to deoxidize metal ions included in the slurry solution. A quantity of current flowing in the slurry solution is detected by the deoxidation. A variation of a content ratio of the metal ions included in the slurry solution is analysed to detect an end point by a variation of the quantity of current.