| 摘要 |
PURPOSE: A heater assembly of an apparatus for manufacturing a semiconductor device is provided to prevent a gap between a chamber and a heater, by making a heater block of a high temperature contact a power connector having a relatively low temperature because of a contact with a cooling line, so that pressure is generated by a temperature difference and a variation is caused by the temperature difference. CONSTITUTION: A heater block(11) is inserted into a hole formed in a chamber plate(19), and an upper part of the heater block has a plain surface on which a wafer can be placed. A power connector(23) is installed in an end part of a portion where the heater block is inserted into the hole, connecting an external power source and the heater block. A cooling line(27) is installed in a periphery of the power connector. The power connector is extended to an outer portion of the chamber plate in which the heater block is installed, and the cooling line is installed in the portion of the power connector extended outwardly.
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