| 发明名称 |
METHOD FOR PRODUCING WIRINGS HAVING SOLDER BUMPS |
| 摘要 |
According to the invention, the conductor pattern is configured such that the connection pads (P1) are respectively connected via a conductor region with a reduced width (LB1) to the conductor tabs (LZ) which extend the conductor. A solder layer deposited on the conductor pattern is preferably remelted by a laser beam, whereby the solder flows up to the connection pads (P1) and forms solder bumps there. |
| 申请公布号 |
EP1082884(A1) |
申请公布日期 |
2001.03.14 |
| 申请号 |
EP19990927832 |
申请日期 |
1999.06.01 |
| 申请人 |
SIEMENS S.A. |
发明人 |
ASCHENBRENNER, ROLF;KLOESER, JOACHIM;JUNG, ERIK;BOONE, LUC;DE STEUR, HUBERT;HEERMAN, MARCEL;VAN PUYMBROECK, JOZEF |
| 分类号 |
B23K1/00;B23K1/005;B23K101/40;H01L21/48;H01L21/60;H05K1/11;H05K3/06;H05K3/24;H05K3/34 |
主分类号 |
B23K1/00 |
| 代理机构 |
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