发明名称 |
Power semiconductor module |
摘要 |
A semiconductor power module with an electrically insulating and thermally conductive substrate (20) on whose surface power semiconductors (21) and electrical contact surfaces are fitted has a press-on device (31) for bringing the underside of the substrate into thermal contact with a heat sink (30). This device serves to press the substrate on the heat sink and also as an electrical feed to the electrical contact surfaces. |
申请公布号 |
EP1083599(A2) |
申请公布日期 |
2001.03.14 |
申请号 |
EP20000119604 |
申请日期 |
2000.09.07 |
申请人 |
STILL GMBH |
发明人 |
FROMME, GEORG, DR.-ING.;SUCHANEK, JOSEPH, DIPL.-ING. |
分类号 |
H01L23/051;H01L23/36;H01L23/40;H01L23/48;H01L25/07;H01L25/16 |
主分类号 |
H01L23/051 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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