Process for mounting components on a printed circuit board

摘要

The component mounting method has a conductive coating (7), e.g. of Au, applied to the inside walls of blind bores (6) provided in the surface of the printed circuit board (1), before insertion of the electronic component contact wires (5) in the blind bores, for connection to the conductive coating via a solder material (8), using a re-flow soldering technique.