发明名称 Moisture-curing polyurethane hot-melt adhesive
摘要 <p>In the present invention there is disclosed a moisture-curing polyurethane hot-melt adhesive intended for use in shoe industry and including (A) at least one polyurethane prepolymer containing a) 15 to 35 percent by weight of at least one polyisocyanate, b) 10 to 70, particularly 15 to 35 percent by weight of at least one polyalkylene glycol based on total hot-melt adhesive, c) 5 to 65 percent by weight, preferably 30 to 50 percent by weight of at least one polyester glycol, having glass transition temperature in the range of -40 to +50 degC, and B) optionally other additives such as d) 0 to 15 percent by weight, preferably 3 to 10 percent by weight of a resin, and e) 0 to 0.5, preferably 0.01 to 0.1 percent by weight of a stabilizer. In the present invention there is also described a process for preparing the above-specified hot-melt adhesive as well as use thereof.</p>
申请公布号 CZ287996(B6) 申请公布日期 2001.03.14
申请号 CZ19950001320 申请日期 1993.11.16
申请人 HENKEL KGAA 发明人 HEIDER ROLAND
分类号 A43D25/06;C08G18/12;C08G18/40;C09J5/06;C09J175/00;C09J175/04;C09J175/06;C09J175/08;(IPC1-7):C08G18/40;A43D86/00 主分类号 A43D25/06
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