发明名称 |
Surface-protecting film and resin-sealed semiconductor device having said film |
摘要 |
A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition:wherein R1 is a trivalent or tetravalent aromatic group; R2 and R3 are each a tetravalent organic group having 4 or more carbon atoms; R4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
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申请公布号 |
US6200831(B1) |
申请公布日期 |
2001.03.13 |
申请号 |
US20000528439 |
申请日期 |
2000.03.17 |
申请人 |
HITACHI, LTD. |
发明人 |
TANAKA JUN;KATAOKA FUMIO;KIKKAWA HARUHIKO;OBARA ISAO;ISODA KEIKO |
分类号 |
C08G73/10;H01L23/31;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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