| 摘要 |
A wiring substrate used for a resin-sealing type semiconductor device is provided with an insulating substrate in which a through hole used for connecting an external terminal is formed, a wiring pattern formed on a semiconductor-chip packaging surface side of the insulating substrate, a land section that is formed at an end of the wiring pattern in a manner so as to cover the through hole from the semiconductor-chip packaging surface side, and that is used for connecting the external connecting terminal to the wiring pattern from the surface side opposite to the above-mentioned semiconductor-chip packaging surface side of the insulating substrate, and a through-hole opening section that allows the through hole to be partially open on the semiconductor-chip packaging surface side. This arrangement makes it possible to prevent problems of separation and swelling of resin caused by bubbles and moisture expanded by heat, which reside in the interface between the wiring substrate used for the resin-sealing type semiconductor device and the semiconductor chip packaged on the wiring substrate used for the resin-sealing type semiconductor device.
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