发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having a core transistor and an I/O transistor on the same semiconductor substrate and a structure with a gate length of the I/O transistor reducible, and to provide its manufacturing method. SOLUTION: The semiconductor device comprises the core transistor and the I/O transistor on the same semiconductor substrate (100). The core transistor comprises a gate insulating film (102a), a gate electrode (103a), a side-wall (105a), an extension diffusion layer (104a), and a source-drain diffusion layer (106a). The I/O transistor comprises a gate insulating film (102b), a gate electrode (103b), a side-wall (105b), and a source-drain diffusion layer (106b). A channel region and the source-drain diffusion layer (106b) positioned directly under the gate insulating film (102b) of the I/O transistor are offset in a region directly under the side-wall (105b). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007103753(A) 申请公布日期 2007.04.19
申请号 JP20050293234 申请日期 2005.10.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAMAOKI NORIHIKO
分类号 H01L21/8234;H01L21/28;H01L21/768;H01L27/088;H01L29/417;H01L29/423;H01L29/49 主分类号 H01L21/8234
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