发明名称 Method of controlling substrate processing apparatus and substrate processing apparatus
摘要 It is an object of the present invention to realize, in a coating and developing apparatus including an inspection section, reduction in the startup time, cost reduction, and an improved operating rate of the inspection section. In the present invention, a control program of the coating and developing apparatus is set such that a processing flow and an inspection flow can be independently executed, the processing flow being a flow in which a substrate is carried to a processing station from a cassette station to be processed in the processing station and an aligner and thereafter is returned to the cassette station, and the inspection flow being a flow in which the substrate is carried from the cassette station to an inspection station to be inspected there, and is thereafter returned to the cassette station. At startup of the coating and developing apparatus, the inspection flow and the processing flow are executed, and an evaluation work of an inspection unit of the inspection station and an adjustment work of a processing unit in the processing station can proceed simultaneously. When the inspection station is idle, a substrate can be carried from an external part to the cassette station to be inspected there.
申请公布号 US2007088450(A1) 申请公布日期 2007.04.19
申请号 US20040581073 申请日期 2004.11.30
申请人 SHINOZUKA SHINICHI;WADA SHIGEKI;YAMASHITA MASAMI 发明人 SHINOZUKA SHINICHI;WADA SHIGEKI;YAMASHITA MASAMI
分类号 G05B19/418;G03F7/16;G03F7/30;H01L21/00;H01L21/02;H01L21/027;H01L21/677 主分类号 G05B19/418
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