DETERGENT FOR SEMICONDUCTOR PART, CLEANING OF SEMICONDUCTOR PART, COMPOSITION FOR POLISHING AND POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a detergent having a slight load on environment and high cleaning effects on impurities remaining on a semiconductor part such as a semiconductor substrate after chemomechanical polishing(CMP). SOLUTION: This detergent for a semiconductor part comprises at least two kinds of (co)polymers of a (co)polymer having carboxylic acid (salt) groups, a (co)polymer having sulfonic acid (salt) groups and a (co)polymer having phoshonic acid (salt) groups and, as necessary, further contains a phosphonic acid compound therein.