| 摘要 |
PROBLEM TO BE SOLVED: To obtain a brazing material for a high reliability substrate of a ceramic substrate and an aluminum metal plate by including Mg, at least one or more kinds of elements out of Cu, Si and Ge, and the balance of Al. SOLUTION: Temperature, where at least one part is formed into a liquid phase, is 500 deg.C-630 deg.C, and it is preferable that Mg is 0.05-3 wt.%. It is preferable that a ceramic substrate is any of aluminum nitride, silicon nitride, silicon carbide, or alumina. However, in consideration of a power device with large power and large heat generation, aluminum nitride and silicon nitride with high insulation resistance and high heat conductivity are suitable. In consideration of reliability after jointing, it is desired that purity of the aluminum plate is 99.0 wt.% or more. By lowering the jointing temperature of the Al circuit material and the like ceramic substrate, a thermal stress generated at the manufacturing time can be reduced, so as to endure the thermal stress caused by a heat cycle. Thereby, such a substrate for a power module is obtained, which can be applied for the uses of electric vehicles, railways or the like. |
