| 摘要 |
A method and apparatus for protection of the interconnection elements of a substrate. In one embodiment, the present invention comprises a substrate having interconnection elements extending therefrom and a contact protector coupled to the substrate, wherein a spring mechanism separates the substrate and the contact protector. The contact protector supports and positions an electronic assembly having electrical contacts and has a plurality of slots allowing the interconnection elements to move freely therethrough. The electronic assembly is depressed such that the interconnection elements of the substrate extend through the slots in the contact protector to form an electrical connection with the electronic assembly. When released, the contact protector is raised such that the interconnection elements are protected and no electrical connection exists between the electronic assembly and the substrate. |
