| 摘要 |
PROBLEM TO BE SOLVED: To provide a table for a wafer polishing device strong against destruction and excellent in soaking and heat resistance. SOLUTION: A wafer polishing device 1 is provided with a table 2 and a wafer hold plate 6. A semiconductor wafer 5 held to a hold plate 6a of the plate 6 is brought into slide contact with a polishing surface 2a provided in an upper part of the table 2. The table 2 is a layered structure laminating a plurality of sheets of base materials 11A, 11B made of silicon carbide sintered material. A fluid flow path 12 is formed in an interface of the base material 11A, 11B. The fellow each base material 11A, 11B is connected through a brazing filler metal layer 14 containing titanium. |
