| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition excellent in resistance to soldering heat by using an epoxy resin containing a phenyl sulfide-type epoxy resin and a novolak epoxy resin, a curing agent containing a phenol-aralkyl resin, a cure accelerator containing a betaine-type adduct of an organic tertiary phosphine to p-benzoquinone, and an inorganic filler as essential ingredients. SOLUTION: The epoxy resin contains a phenyl sulfide-type epoxy resin of formula I and a novolak epoxy resin of formula II in a wt. ratio of (3/7)-(7/3). The curing agent contains at least 50 wt.% phenol-aralkyl resin of formula III. In the formulas, R1 to R4 are each H or a (substituted) 1-5C monovalent hydrocarbon group; (n) is 0-10; and R is H or a (substituted) 1-10C monovalent hydrocarbon group. The cure accelerator preferably contains a betaine-type adduct of triphenylphosphine to p-benzoquinone. The content of the inorganic filler is preferably 55-90 vol.% based on the total epoxy resin molding material. |
