| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a card without exposing a ruggedness of a component such as an IC chip, condenser, antenna coil or the like mounted or formed on a mounting board on its surface. SOLUTION: The method for manufacturing a card comprises the steps of supplying a pair of sheet members 20, 22 to both surface sides of a continuously supplied mounting board 1 so as to sandwich the board 12 therebetween, supplying an adhesive of a flowing state between surfaces of the board 12 and the members 20, 22, specifying a distance between the pair of the members 20, 22 to a predetermined interval, and curing the adhesive.</p> |
