发明名称 SOLDER ALLOY COMPOSION MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain an alloy composition material having good soldering characteristics without problems against environments or human bodies by composing the material of Sn, at least one kind of metals chosen from a group of Ag, Cu, Bi, In, Zn and Ge, and Pb where Pb content is a specific ratio. SOLUTION: The Pb content is 0.01-0.3 wt.%. It is preferable that Sn content is 90 wt.% or more. Within such a range, solder wettability is especially good, and solderability is good so as to maintain a proper melting temperature. When the material includes each of metals, it is preferable that Ag is 0.2-4.0 wt.%, Cu is 0.1-3.0 wt.%, Bi is 0.01-2.0 wt.%, In is 0.1-9.0 wt.%, Zn is 0.1-9.0 wt.%, and Ge is 0.005-0.5 wt.%. At least one kind of metals such as Ag, Cu, Bi, In, Zn and Ge other than Sn and Pb may be included. The metals improve wettability of the alloy composition material, mechanical strength, elongation and thermal fatigue resistance, so as to lower the melting point and reduce generation volume of dross.
申请公布号 JP2001062585(A) 申请公布日期 2001.03.13
申请号 JP19990242691 申请日期 1999.08.30
申请人 SONY CORP 发明人 TAKEDA NAOKO;INAGAKI YASUSHI
分类号 B23K35/26;H05K3/34;(IPC1-7):B23K35/26 主分类号 B23K35/26
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