| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is suited in forming insulating films capable of exhibiting excellent crack resistance, high flexibility, and excellent reliability at the time of bending the substrate or mounting parts on the substrate in the film formation of insulating films on the substrate formed from organic materials. SOLUTION: The epoxy resin composition is constituted by comprising (1) an epoxy resin component selected from the group consisting of an aromatic epoxy resin having an aromatic ring in the molecule, an alicyclic epoxy resin having a cyclohexane skeleton in the molecule, and a mixture thereof and (2) an epoxy curing agent having two or more hydroxyl groups and two or more aromatic rings in the molecule. |
