发明名称 |
Semiconductor device using wiring tape |
摘要 |
A printed circuit board is connected to a single-layer wiring tape so as to surround an integrated circuit element which is connected to the single-layer wiring tape. Wiring patterns of the wiring tape are formed from either a power electrode or a ground electrode on the integrated circuit element to a planar metal pattern on the printed circuit board, from the planar metal pattern on the printed circuit board to either an external power terminal or an external ground terminal on the wiring tape, and from a signal electrode on the integrated circuit element to an external signal terminal on the wiring tape. |
申请公布号 |
US6201298(B1) |
申请公布日期 |
2001.03.13 |
申请号 |
US19990301176 |
申请日期 |
1999.04.28 |
申请人 |
NEC CORPORATION |
发明人 |
SATO RYOJI;TAKEUCHI MASANORI;KATA KEIICHIRO |
分类号 |
H01L23/12;H01L23/498;H01L23/50;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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