RESIN SEAL-TYPE SEMICONDUCTOR DEVICE AND RESIN COMPOSITION THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide the subject semiconductor device low in thermal stress developing due to the difference in coefficient of linear expansion from the semiconductor element and excellent in sustained reliability, and to obtain the other subject resin composition therefor. SOLUTION: This resin composition comprises a resin (consisting mainly of an epoxy resin and also containing a silicone polymer) and >=75 wt.% of silica powder; wherein a >=90 wt.% equivalent of the silica powder has a particle size of 0.5-100μm, having such a distribution as to be shown by nearly a straight line when represented with an RRS particle size diagram and/or a >=60 wt.% equivalent of the silica powder has a particle size of <=20μm. The other objective semiconductor device is such as to be sealed with the above resin composition.