发明名称 PHENOLIC RESIN, EPOXY RESIN, THERMOSETTING RESIN COMPOSITION, AND PRODUCTION OF RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a phenol resin used to form a resin composition that can give a cured product excellent in humidity resistance and adhesion by using a phenolic resin and/or an epoxy resin derived therefrom. SOLUTION: This resin is represented by formula I [wherein a plurality of Rs are each independently hydrogen, a 1-10C hydrocarbon group, an alkoxyl, hydroxyl, or the like; a plurality of Xs are each independently oxygen or sulfur; a plurality of Qs are each independently a 1-5C alkyl; (n) is a real number of 1.2-8 on the average; a plurality of i(s) are each independently an integer of 0-4; and a plurality of j(s) are each independently an integer of 0-3, provided that when (i) or (j) is 0, (R)i and (Q)j are each hydrogen]. The resin further satisfies the relationships: A>B×(i+1) (wherein A is the amount of a component represented by formula II, and B is the amount of a component represented by formula III). The epoxy resin can be obtained by glycidyl-etherifying the phenolic hydroxyl groups of a phenolic resin.
申请公布号 JP2001064339(A) 申请公布日期 2001.03.13
申请号 JP19990238692 申请日期 1999.08.25
申请人 NIPPON KAYAKU CO LTD 发明人 KUBOKI KENICHI;NAKAYAMA KOJI
分类号 C08G8/20;C08G59/08;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G8/20 主分类号 C08G8/20
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