| 摘要 |
PROBLEM TO BE SOLVED: To obtain a low temperature curable liquid resin composition which excels in potting workability, can quickly be cured at a lower temperature compared to conventional products, and has high adhesion strength to a polyimide film to be used as the carrier tape and is suited in sealing semiconductors in potting when using a solvent type liquid resin composition. SOLUTION: The low temperature curable liquid resin compositions comprises (A) a liquid epoxy resin, (B) a liquid phenolic resin curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a propylene glycol based solvent such as polypropylene glycol methyl ether acetate as the essential components, and the liquid phenolic resin curing agent (B) is a liquid novolak type phenolic resin having a viscosity at 25 deg.C of 2,000-30,000 cP.
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