| 摘要 |
PROBLEM TO BE SOLVED: To form a low-permittivity uniform film excellent in adhesiveness on a semiconductor substrate by using a composition containing a polyquinoline resin and a silane compound. SOLUTION: A composition comprising a silane compound represented by formula I, II of III (wherein R1 to R8 are each H, methyl, ethyl, propyl, butyl, hexyl, cycolohxyl, phenyl or benzyl; (k) is 1 or 2; (m), (a), (p), (r), (s) and (t) are each an integer of 0 to 10; and (n), (q) and (u) are each 1, 2 or 3) and a polyquinoline resin is used. Preferably, 100 pts.wt. polyquinoline resin is compounded with 0.01 to 15 pts.wt. silane compound and 600 to 2,000 pts.wt. organic solvent (e.g. phenol). Except specified areas of a circuit element, the surface of a semiconductor substrate is covered with a protective film 2; on the uncovered areas of the circuit element, a first conductor layer 3 is formed; and the semiconductor substrate 1 is coated with the composition e.g. by the spinner method and is thermally treated to form an interlayer insulation film layer 4. The process is repeated, and finally a surface protection film layer 8 is formed.
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