| 摘要 |
A sputtering target is pre-conditioned prior to use of the target in a sputtering process by removing a damaged surface layer of a sputtering surface of the target. In one version, the sputtering surface of the sputtering target is lapped to remove a thickness of at least about 25 microns to obtain a sputtering surface having a surface roughness average of from about 4 to about 32 microinches. In another version, an acidic etchant is used to remove the layer. In yet another version, the damaged surface layer is annealed by heating the surface.
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