发明名称 PHOTOSENSITIVE RESIN AND RESIST INK COMPOSITION USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin which is halogen-free and, in addition, can impart properties such as high flame retardance, excellent heat resistance, moisture, resistance, mechanical properties, and developability to the cured products, and a resist ink composition using the same. SOLUTION: This photosensitive resin is an acid addition vinyl ester resin obtained by adding an ethylenically unsaturated monobasic acid to an epoxy resin, and then, reacting the resulting adduct with a polybasic acid anhydride, and at least a part of the polybasic acid anhydride is a phosphorus-containing compound represented by the formula (wherein R1 and R2 are the same or different and each an aliphatic group or an aromatic group; R3 is a hydrogen atom or a 1-3C alkyl group; (n) and (m) are each an integer of 0-4; and (q) is an integer of 0-3). A photocurable or thermosetting resist ink composition developable with an alkali solution comprises (A) the photosensitive resin, (B) a diluent, (C) a photopolymerization initiator, and (D) a thermosetting component composed of an epoxy compound having two or more epoxy groups per molecule.
申请公布号 JP2001064356(A) 申请公布日期 2001.03.13
申请号 JP19990243957 申请日期 1999.08.30
申请人 TAKEDA CHEM IND LTD 发明人 OKUMURA HIROYA;UCHIDA TOSHIAKI;TAKEUCHI HIROSHI
分类号 G03F7/027;C08G59/14;C08G59/40;C09D11/033;C09D11/10;C09D11/101;C09D11/102;C09D11/106 主分类号 G03F7/027
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