| 摘要 |
A method and an apparatus for assembling a semiconductor laser module to prevent excess solder from scattering without saving an amount of the solder is disclosed. The method has a feature that, after heating up the die-bonder and holding the temperature of the die-bonder in a preset period, the excess solder may be sucked with the nozzle by scanning the nozzle along the gap between the carrier and the TEC. Because the whole boundary is scanned, the excess solder may be sucked even if the solder oozes out any portion on the boundary.
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