APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE AND METHOD FOR FORMING PATTERN OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: An apparatus for fabricating a semiconductor device and a method for forming a pattern of a semiconductor device are provided to form a uniform and desired contact hole pattern by performing a flow process on a photoresist pattern. CONSTITUTION: A wafer loading portion(42) is used for loading a wafer cassette including a multitude of wafer. An HMDS coating portion(34) is used for increasing an adhesive strength of a photoresist on a surface of the wafer. A developing portion(44) is used for performing a developing process for the exposed wafer and forming a photoresist pattern on the wafer. A soft bake portion(37) is used for removing a solvent from the wafer. A PEB(Post Exposure Bake) portion(42) is used for removing a standing wave from the wafer. A hard bake portion(40) is used for hardening the photoresist pattern. A UV(Ultra-Violet) bake portion(48) is used for irradiating a UV ray to the developed wafer.