Thinning semiconductor wafers with contacts, involves forming protective resin reinforcing layer on component side, then polishing and thinning at rear

摘要

A protective resin layer (3) is formed on the face of a semiconductor wafer (1), which has semiconductor elements (2) mounted upon it. The rear surface of the wafer is polished and thinned, following the treatment to form the resin layer. An Independent claim is included for a device as formed above, in which the semiconductor wafer thickness is <= 300 mu m.