发明名称 LOW COST CONFORMAL EMI/RFI SHIELD
摘要 <p>An EMI/RFI shield includes a shell made from a metalized polymeric material with a shape that is predetermined to form within at least one shielded cavity. The shell has sidewalls that terminate in a flange extending at an angle to the sidewalls. The flange has a lower surface for electrically coupling the shell to a predetermined electrical potential and an upper surface for engaging a structure, preferably a protruding rib from a cover, that exerts a compressive force on the top surface for urging the lower surface into an electrical coupling arrangement with an underlying planar conductor carrying the predetermined electrical potential (e.g., ground). The lower surface can include or be placed upon a layer of electrically conductive compliant material, such as a conductive adhesive. At least one of the sidewalls can include a projecting fluted structure having a size and location that is predetermined to engage a side of the structure that exerts the compressive force.</p>
申请公布号 WO2001017327(A1) 申请公布日期 2001.03.08
申请号 US2000023764 申请日期 2000.08.29
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