| 发明名称 |
Verfahren zur Erzeugung von Lothügeln auf einem Substrat |
| 摘要 |
In a method of producing solder bumps on a substrate by contact with a molten solder bath, at least part of the substrate is cooled during contact with (preferably immersion in) the solder bath. Preferably, the substrate is a chip or wafer and is briefly dipped into the solder bath or wetted by a solder wave. |
| 申请公布号 |
DE19625139(C2) |
申请公布日期 |
2001.03.08 |
| 申请号 |
DE1996125139 |
申请日期 |
1996.06.24 |
| 申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
OPPERMANN, HANS-HERMANN |
| 分类号 |
B23K1/08;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K1/08 |
| 代理机构 |
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