发明名称 ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
摘要 A peelable electrolytic copper foil with carrier foil having a carrier foil (5), a bonding interface layer (8) formed on a surface thereof, and an electrolytic layer (5) formed by deposition on the interface layer, characterized in that the bonding interface layer (8) comprises isocyanuric acid. The peelable electrolytic copper foil with carrier foil (3) is free from the defect of a conventional peelable electrolytic copper foil with a carrier foil that a peel adhesion is unstable with respect to the peeling of the carrier foil after the formation by hot pressing at a temperature higher than 300 DEG C and provides a peelable electrolytic copper foil with a carrier foil which is capable of undergoing the peeling of the carrier foil with stability and by a small force.
申请公布号 WO0116402(A1) 申请公布日期 2001.03.08
申请号 WO2000JP05363 申请日期 2000.08.10
申请人 MITSUI MINING & SMELTING CO., LTD.;KATAOKA, TAKASHI;HIRASAWA, YUTAKA;YAMAMOTO, TAKUYA;IWAKIRI, KENICHIRO;HIGUCHI, TSUTOMU;SUGIMOTO, AKIKO;YOSHIOKA, JUNSHI;OBATA, SHINICHI;TOMONAGA, SAKIKO;DOBASHI, MAKOTO 发明人 KATAOKA, TAKASHI;HIRASAWA, YUTAKA;YAMAMOTO, TAKUYA;IWAKIRI, KENICHIRO;HIGUCHI, TSUTOMU;SUGIMOTO, AKIKO;YOSHIOKA, JUNSHI;OBATA, SHINICHI;TOMONAGA, SAKIKO;DOBASHI, MAKOTO
分类号 C07D251/32;C25D1/04;C25D1/22;C25D3/38;C25D5/54;H05K1/09;H05K3/00;H05K3/02;(IPC1-7):C25D1/22 主分类号 C07D251/32
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