| 摘要 |
A device includes a substrate (10) comprising a voltage switchable dielectric material. A current carrying formation (30) is formed on a plurality of selected sections of a surface of the substrate. Another device includes a substrate (310) comprising a voltage switchable dielectric material. The substrate includes a first surface (312) and a second surface (313) opposite to the first surface. A via (350) extends between the first surface (312) and the second surface (313) of the substrate. A current carrying formation (330, 340) is formed on a plurality of selected sections of the first and second surfaces (312, 313), as well as on a surface of the substrate defining the vias (350) to extend an electrical connection from the first surface (312) to the second surface (313). |
